In 2022, the Biden administration introduced sweeping export controls covering advanced computing chips (such as FinFET/GAAFET logic chips ≤14 nm, DRAM ≤18 nm, and NAND flash ≥128 layers), semiconductor manufacturing equipment, and foreign-produced items for supercomputing or chip development. Under these rules, Chinese facilities faced a “presumption of denial” for licences. In December 2022, more Chinese firms, including memory-chip maker YMTC, were added to the Entity List, cutting them off from US-origin technologies. April 2023 saw restrictions expand to AI chips, cloud access, and model weights under the “AI Diffusion” policy, followed by further tightening in March 2024 on US AI chips and chipmaking tools.